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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/29 tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com serial eeprom series automotive eeprom 105 operation microwire bus eeprom (3-wire) br93axx-wm (1k 2k 4k 8k 16k) general description br93axx-wm is serial eeprom of serial 3-line interface method. features ? 3-line communications of chip sele ct, serial clock, serial data input / output (the case where input and output are shared) ? wide temperature range -40 to +105 ? operations available at high s peed 2mhz clock(2.5v to 5.5v) ? speed write available (write time 5ms max.) ? same package and pin layout from 1kbit to 16kbit ? 2.5v to 5.5v single power source operation ? address auto increment function at read operation ? write mistake prevention function ? write prohibition at power on ? write prohibition by command code ? write mistake prevention function at low voltage ? program cycle auto delete and auto end function ? program condition display by ready / busy ? low current consumption ? at write operation (at 5v) : 1.2ma (typ.) ? at read operation (at 5v) : 0.3ma (typ.) ? at standby condition (at 5v) : 0.1 a (typ.)(cmos input) ? ttl compatible (input / output s) ? data retention for 40 years(ta 25 ) ? endurance up to 1,000,000 times(ta 25 ) ? data at shipment all addresses ffffh ? aec-q100 qualified packages w(typ.) x d(typ.) x h(max.) br93axx-wm package t ype sop8 sop-j8 tssop-b8 msop8 capacity bit format type power source voltage f rf fj rfj rfvt rfvm 1kbit 64 16 br93a46-wm 2.5v to 5.5v 2kbit 128 16 br93a56-wm 2.5v to 5.5v 4kbit 256 16 br93a66-wm 2.5v to 5.5v 8kbit 512 16 br93a76-wm 2.5v to 5.5v 16kbit 1k 16 br93a86-wm 2.5v to 5.5v sop8 5.00mm x 6.20mm x 1.71mm sop- j8 4.90mm x 6.00mm x 1.65mm msop8 2.90mm x 4.00mm x 0.90mm tssop-b8 3.00mm x 6.40mm x 1.20mm downloaded from: http:///
datasheet datasheet 2/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com absolute maximum ratings (ta=25 ) parameter symbol limits unit remarks supply voltage v cc -0.3 to +6.5 v permissible dissipation pd 0.45 (sop8) w when using at ta=25 or higher, 4.5mw to be reduced per 1 . 0.45 (sop-j8) when using at ta=25 or higher, 4.5mw to be reduced per 1 . 0.33 (tssop-b8) when using at ta=25 or higher, 3.3mw to be reduced per 1 . 0.31 (msop8) when using at ta=25 or higher, 3.1mw to be reduced per 1 . storage temperature range tstg -65 to +125 operating temperature r ange topr -40 to +105 terminal voltage \ -0.3 to v cc +0.3 v memory cell characteristics (v cc =2.5v to 5.5v) parameter limit unit condition min. typ. max. endurance *1 1,000,000 - - times ta 25 550,000 ta 60 200,000 ta 85 100,000 - - ta 105 data retention *1 40 - - years ta 25 10 - - ta 105 shipment data all address ffffh *1 not 100 tested recommended operating ratings parameter symbol limits unit power source voltage v cc 2.5 to 5.5 v input voltage v in 0 to v cc electrical characteristics (unless otherwise specified, v cc =2.5v to 5.5v, ta=-40 to +105 ) parameter symbol limits unit condition min. typ. max. l input voltage 1 v il1 -0.3 - 0.8 v 4.0v v cc 5.5v l input voltage 2 v il2 -0.3 - 0.2 x v cc v v cc 4.0v h input voltage 1 v ih1 2.0 - v cc +0.3 v 4.0v v cc 5.5v h input voltage 2 v ih2 0.7 x v cc - v cc +0.3 v v cc 4.0v l output voltage 1 v ol1 0 - 0.4 v i ol =2.1ma, 4.0v v cc 5.5v l output voltage 2 v ol2 0 - 0.2 v i ol =100 a h output voltage 1 v oh1 2.4 - v cc v i oh =-0.4ma, 4.0v v cc 5.5v h output voltage 2 v oh2 v cc -0.2 - v cc v i oh =-100 a input leak current i li -1 - 1 a v in =0v to v cc output leak current i lo -1 - 1 a v out =0v to v cc , cs=0v current consumption i cc1 - - 3.0 ma f sk =2mhz, t e/w =5ms (write) i cc2 - - 1.5 ma f sk =2mhz (read) i cc3 - - 4.5 ma f sk =2mhz, t e/w =5ms (wral, eral) standby current i sb - - 2 a cs=0v, do=open downloaded from: http:///
datasheet datasheet 3/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com operating timing characteristics (ta=-40 to +105 , v cc =2.5v to 5.5v) parameter symbol 2.5v v cc 5.5v unit min. typ. max. sk frequency f sk - - 2 mhz sk h time t skh 230 - - ns sk l time t skl 230 - - ns cs l time t cs 200 - - ns cs setup time t css 50 - - ns di setup time t dis 100 - - ns cs hold time t csh 0 - - ns di hold time t dih 100 - - ns data 1 output delay time t pd1 - - 200 ns data 0 output delay time t pd0 - - 200 ns time from cs to output establishment t sv - - 150 ns time from cs to high-z t df - - 150 ns write cycle time t e/w - - 5 ms sync data input / output timing data is taken by di sync with the rise of sk. at read operation, data is output from do in sync with the rise of sk. the status signal at write (ready / busy) is output after tcs fr om the fall of cs after write command input, at the area do where cs is h, and valid until the next command start bit is input. and, while cs is l, do becomes high-z. after completion of each mode execution, set cs l once for internal circuit reset, and execute the following operation mode. cs sk do(read) di do( write) tcss tskh tskl tcsh tdis tdih t pd1 t pd0 tdf status valid downloaded from: http:///
datasheet datasheet 4/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com block diagram pin configurations pin descriptions command decode control clock generation power source voltage detection write prohibition high voltage occurrence command register address buffer sk di dummy bit do data register r/w amplifier 6bit 7bit 8bit 9bit 10bit 6bit 7bit 8bit 9bit 10bit 16bit 16bit 1,024 bit 2,048 bit 4,096 bit 8,192 bit 16,384 bit eeprom cs address decoder pin name i / o function v cc - power source gnd - all input / output reference voltage, 0v cs input chip select input sk input serial clock input di input start bit, ope code, address, and serial data input do output serial data output, ready / busy internal condition display output nc - non connected terminal, vcc, gnd or open nc gnd do di nc vcc cs sk top view br93axxf-wm:sop8 br93axxfj-wm:sop-j8 vcc nc nc gnd cs sk di do top view br93axxrf-wm:sop8 br93axxrfj-wm:sop-j8 br93axxrfvt-wm:tssop-b8 br93axxrfvm-wm:msop8 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 downloaded from: http:///
datasheet datasheet 5/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves (the following characteristic data are typ. values.) figure 4. l output voltage vol-iol (vcc=4.0v) figure 1. h input voltage vih (cs, sk, di) figure 2. l input voltage vil (cs,sk,di) figure 3. l output voltage vol-iol (vcc=2.5v) downloaded from: http:///
datasheet datasheet 6/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 5. h output voltage voh-ioh figure 6. h output voltage voh-ioh (vcc=4.0v) figure 7. input leak cu rrent ili (cs, sk, di) figure 8. output leak current ilo (do) input leak current : i li (ua) output leak current : i lo (ua) downloaded from: http:///
datasheet datasheet 7/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 9. current consumption at write operation icc1 (write, fsk=2mhz) figure 10. consumption current at read operation icc2 (read, fsk=2mhz) figure 11. consumption current at wral operation icc3 (wral, fsk=2mhz) figure 12. consumption current at standby isb stand by current : i sb (ua) downloaded from: http:///
datasheet datasheet 8/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 13. sk frequency fsk figure 15. sk low time tskl figure 14. sk high time tskh figure 16. cs low time tcs downloaded from: http:///
datasheet datasheet 9/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 18. cs setup time tcss figure 17. cs hold time tcsh figure 19. di hold time tdih figure 20. di setup time tdis downloaded from: http:///
datasheet datasheet 10/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 21. data 0 output delay time tpd0 figure 22. output data 1 delay time tpd1 figure 24. time from cs to high-z tdf figure 23. time from cs to output establishment tsv supply voltage : v cc (v) downloaded from: http:///
datasheet datasheet 11/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com typical performance curves \ continued figure 25. write cycle time te/w downloaded from: http:///
datasheet datasheet 12/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com description of operations communications of the microwire bus are carried out by sk (ser ial clock), di (serial data input ), do (serial data output), and cs (chip select) for device selection. when to connect one eeprom to a microcontroller, connect it as shown in figur e 26 (a) or figure 26 (b). when to use the input and output co mmon i/o port of the microcontroller, connect di and do vi a a resistor as shown in figure 26 (b) (refer to page18.), and connection by 3 lines is available. in the case of plural connections, refer to figure 26 (c). communications of the microwire bus are started by the first 1 input after the rise of cs. this input is called a start bit. after input of the start bit, input ope code, address and dat a. address and data are input all in msb first manners. 0 input after the rise of cs to the star t bit input is all ignored. therefore, when there is limitation in the bit width of p io of the microcontroller, input 0 before the start bit input, to control the bit width. command mode command start bit ope code address data br93a46-wm br93a56/66-wm br93a76/86-wm read (read) *1 1 10 a5,a4,a3,a2,a1,a0 a7,a6,a5,a4,a3,a2,a1,a0 a9,a8,a7,a6,a5,a4,a3,a2,a1,a0 d15 to d0(read data) write enable (wen) 1 00 1 1 * * * * 1 1 * * * * * * 1 1 * * * * * * * * write (write) *2 1 01 a5,a4,a3,a2,a1,a0 a7,a6,a5,a4,a3,a2,a1,a0 a9,a8,a7,a6,a5,a4,a3,a2,a1,a0 d15 to d0(write data) write all (wral) *2 1 00 0 1 * * * * 0 1 * * * * * * 0 1 * * * * * * * * d15 to d0(write data) write disable (wds) 1 00 0 0 * * * * 0 0 * * * * * * 0 0 * * * * * * * * erase (erase) 1 11 a5,a4,a3,a2,a1,a0 a7,a6,a5,a4,a3,a2,a1,a0 a9,a8,a7,a6,a5,a4,a3,a2,a1,a0 chip erase (eral) 1 00 1 0 * * * * 1 0 * * * * * * 1 0 * * * * * * * * ? input the address and the data in msb first manners. ? as for *, input either vih or vil. *start bit acceptance of all the commands of this ic starts at recognition of the start bit. the start bit means the first 1 input after the rise of cs. *1 as for read, by continuous sk clock input after settin g the read command, data output of the set address starts, and address data in significant order are sequentially output continuously. (auto increment function) *2 when the read and the write all commands are executed, data written in the selected memory cell is automatically deleted, a nd input data is written. figure 26-(a) connection by 4 lines cs sk do di cs sk do cs sk di do figure 26-(b) connection by 3 lines cs sk di do cs3cs1 cs0 sk do di figure 26-(c) connection exam ple of plural devices figure 26. connection method with microcontroller micro- controller br93axx micro- controller micro- controller a7 of br93a56-wm becomes don't care. a9 of br93a76-wm becomes don't care. br93axx cs sk di do device 1 cs sk di do device 2 cs sk di do device 3 downloaded from: http:///
datasheet datasheet 13/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com timing chart 1) read cycle (read) *1 start bit when data 1 is input for the first time after the rise of cs, this is recognized as a start bit. and when 1 is input after plural 0 are input, it is recognized as a start bit, and the following operation is started. this is common to all the commands to described hereafter. when the read command is recognized, input address data (16bit) is output to serial. and at that moment, at taking a0, in sync with the rise of sk, 0 (dummy bit) is output. and, the following data is output in sync with the rise of sk. this ic has an address auto increment function valid only at read command. this is the function where after the above read execution, by continuously inputting sk clock, the a bove address data is read sequent ially. and, during the auto increment, keep cs at h. 2) write cycle (write) in this command, input 16bit data (d15 to d0) are written to designated addresses (am to a0). the actual write starts by the fall of cs of d0 taken sk clock. when status is not detected, (cs=l fi xed) max. 5ms in conformity with te/w, and when status is detected (cs=h), all commands are not accepted for areas where l (busy) is output from d0, therefor e, do not input any command. 3) write all cycyle (wral) in this command, input 16bit data is written simultaneously to all adresses. data is not written continuously per one word but is written in bulk, the write time is only max. 5ms in conformity with te/w. cs 1 2 1 4 high-z 1 am a1 a0 0 d15 d14 d1 d15 d14 *1 *2 d0 sk di do 0 n n+1 cs 1 2 1 4 high-z 0 a m a 1 a 0 d15 d14 d1 d0 sk di do 1 n status tcs tsv busy te /w ready cs 1 2 1 5 high-z 0 0 0 d15 d14 d1 d0 sk di do n status tcs tsv busy te/ w ready 1 : n= 27, m=7 : n=29, m=9 br93a46-wm : n=25, m=5 br93a56-wm br93a66-wm br93a76-wm br93a86-wm : n=27, m=7 : n=29, m=9 br93a46-wm : n=25, m=5 br93a56-wm br93a66-wm br93a76-wm br93a86-wm : n=27 : n=29 br93a46-wm : n=25 br93a56-wm br93a66-wm br93a76-wm br93a86-wm figure 27. read cycle figure 28. write cycle figure 29. write all cycle downloaded from: http:///
datasheet datasheet 14/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 4) write enable (wen) / disable (wds) cycle at power on, this ic is in write disable status by the in ternal reset circuit. before executing the write command, it is necessary to execute the write enable comm and. and, once this command is executed , it is valid unitl the write disable command is executed or the power is turned off. however, the re ad command is valid irrespective of write enable / diable command. input to sk after 6 clocks of this command is ava ilable by either h or l, but be sure to input it. when the write enable command is executed after power on, write enable status gets in. when the write disable command is executed then, the ic gets in write disable status as same as at power on, and then the write command is canceled thereafter in software manner. however, the read command is executable. in write enable status, even when the write command is input by mistake, write is started. to pr event such a mistake, it is recommended to execute the write disable command after completion of write. 5) erase cycle timing (erase) in this command, data of the designated a ddress is made into 1. the data of the designated addres s becomes ffffh. actual erase starts at the fall of cs after the fall of a0 taken sk clock. in erase, status can be detected in the same manner as in write command. 6) chip erase cycle timing (eral) in this command, data of all addresses is eras ed. data of all addresses becomes ffffh. actual erase starts at the fall of cs after the falll of the n-th clock from the start bit input. in eral, status can be detected in t he same manner as in write command. figure 30. write enable (wen) / disable (wds) cycle cs 1 2 1 1 1 4 high-z sk di do st atus tcs tsv busy te/w ready am a3 a2 a1 n a0 f igure 31. erase cycle timing cs 1 2 1 4 high-z sk di do st atus tcs tsv busy te/ w ready 1 n 0 0 0 f igure 32. chip erase cycle timing : n=11 : n=13 br93a46-wm : n=9 br93a56-wm br93a66-wm br93a76-wm br93a86-wm br93a46-wm : n=9, m=5 br93a56-wm br93a66-wm br93a76-wm br93a86-wm : n=11, m=7 : n=13, m=9 br93a46-wm : n=9 br93a56-wm br93a66-wm br93a76-wm br93a86-wm : n=11 : n=13 cs 1 2 1 5 high-z 0 0 sk di do n 3 4 6 7 8 enable=1 1 disable=0 0 downloaded from: http:///
datasheet datasheet 15/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com application 1) method to cancel each command read write, wral (in the case of br93a46-wm ) 1 address is 8 bits in br93a56-wm, br93a66-wm address is 10 bits in br93a76-wm, br93a86-wm figure 33. read cancel available timing note 1) if vcc is made off in this area, designated address data is not guaranteed, therefore write once again. note 2) if cs is started at the same timing as that of the sk rise, write execution/cancel becomes unstable, therefore, it is recommended to fail in sk=l area. as for sk rise, recommend timing of tcss/tcsh or higher. figure 34. write, wral cancel available timing (in the case of br93a46-wm ) a b a from start bit to 25 clock rise 2 cancel by cs=l b 25 clock rise and after 2 cancellation is not available by any means. if vcc is m ade off in this area, designated address data is not guaranteed, therefore write once again. and when sk clock is input continuously, cancellation is not available. *1 address is 8 bits in br93a56-wm, br93a66-wm address is 10 bits in br93a76-wm br93a86-wm *2 27 clocks in br93a56-wm, br93a66-wm 29 clocks in br93a76-wm br93a86-wm (in the case of br93a86-wm ) a from start bit to 29 clock rise cancel by cs=l b 29 clock rise and after cancellation is not available by any means. if vcc is m ade off in this area, designated address data is not guaranteed, therefore write once again. c 30 clock rise and after cancel by cs=l however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is output continuously is not available. sk di 29 rise of cloc k *2 28 d1 d0 29 30 31 b enlarged figure c a start bit ope code a ddress data 1bit 2bit 6bit 16bit cancel is available in all areas in read mode. ? method to cancel cancel by cs=l *1 *1 start bit ope code a ddress data te/w a *1 1bit 2bit 10bit 16bit c b start bit ope code a ddress data te/w sk ? 25 rise of clock *2 d1 enlarged figure d0 di 24 25 1bit 2bit 6bit 16bit downloaded from: http:///
datasheet datasheet 16/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com erase, eral 2) at standby standby current when cs is l, sk input is l, di input is h, and even with middle electric potential, current does not increase. timing as shown in figure 36, when sk at standby is h, if cs is started, di status may be read at the rise edge. at standby and at power on/off, when to start cs, set sk input or di input to l status. (refer to figure 37) 1 address is 8 bits in br93a56-wm, br93a66-wm address is 10 bits in br93a76-wm 2 11 clocks in br93a56-wm, br93a66-wm 13 clocks in br93a76-wm figure 35. erase, eral ca ncel available timing (in the case of br93a46-wm ) a from start bit to 9 clock rise 2 cancel by cs=l b 9 clock rise and after 2 cancellation is not available by any means. if vcc is made off in this area, designated address data is not guaranteed, therefore write once again. and when sk clock is input continuously, cancellation is not available. (in the case of br93a86-wm ) a from start bit to 13 clock rise cancel by cs=l b 13 clock rise and after cancellation is not available by any means. if vcc is made off in this area, designated address data is not guaranteed, therefore write once again. c 14 clock rise and after cancel by cs=l however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is output continuously is not available. cs sk di start bit input cs=sk=di=h wrong recognition as a start bit cs sk di start bit input if cs is started when sk=l or di=l, a start bit is recognized correctly. figure 36. wrong operating timing figure 37. normal operating timing note 1) if vcc is made off in this area, designated address data is not guaranteed, therefore write once again. note 2) if cs is started at the same timing as that of the sk rise, write execution/cancel becomes unstable, therefore, it is recommended to fail in sk=l area. as for sk rise, recommend timing of tcss/tcsh or higher. sk di 8 a1 a0 enlarged figure 9 9 rise of cloc k 2 *1 a b 1bit 2bit 6bit start bit ope code a ddress 1/2 te/w 1bit 2bit 10bit a c b *1 start bit ope code a ddress te/w sk di 13 rise of cloc k *2 12 d1 13 14 15 b c a enlarged figure downloaded from: http:///
datasheet datasheet 17/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 3) equivalent circuit 4) i/o peripheral circuit 4-1) pull down cs. by making cs=l at power on/off, mistake in operation and mistake write are prevented. pull down resistance rpd of cs pin to prevent mistake in operation and mist ake write at power on/off, cs pull down resistance is necessary. select an appropriate value to this resistance value from microcont roller voh, ioh, and vil characteristics of this ic. 4-2) do is available in both pull up and pull down. do output become high-z in other ready / busy outpu t timing than after data output at read command and write command. when malfunction occurs at hi gh-z input of the microcontroller port connected to do, it is necessary to pull down and pull up do. when there is no influence upon the microcontroller operations, do may be open. if do is open, and at timing to output status ready, at timing of cs=h, sk=h, di=h, eeprom recognizes this as a start bit, resets ready output, and do=high-z, theref ore, ready signal cannot be detected. to avoid such output, pull up do pin for improvement. figure 43. ready output timing at do=open output circuit do oeint. input citcuit cs csint. reset int. input circuit di cs int. input circuit sk cs int. figure 38. output circuit (do) figure 40. input circuit (di) figure 39. input circuit (cs) figure 41. input circuit (sk) microcontroller vohm h output iohm rpd vihe l input eeprom figure 42. cs pull down resistance vohm iohm rpd ??? 2.4 2 10 -3 rpd 1.2 [k ] vohm vihe ??? rpd example) when v cc =5v, vihe=2v, vohm=2.4v, iohm=2ma, from the equation , ? vihe ? vohm ? iohm with the value of rpd to satisfy the above equation, vohm becomes 2.4v or higher, and vihe (=2.0v), the equation is also satisfied. : eeprom vih specifications : microcontroller voh specifications : microcontroller ioh specifications cs sk di do d0 busy ready high-z enlarged cs sk di do busy high-z improvement by do pull up busy ready cs=sk=di=h when do=open cs=sk=di=h when do=pull up do h downloaded from: http:///
datasheet datasheet 18/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com pull up resistance rpu and pull down resistance rpd of do pin as for pull up and pull down resistance value, select an appr opriate value to this resistance value from microcontroller vih, vil, and voh, ioh, vol, iol characteristics of this ic. 5) ready / busy status display (do terminal) (common to br93a46-wm,br93a56-wm, br 93a66-wm, br93a76-wm, br93a86-wm) this display outputs the internal status signal. when cs is started after tcs (min.200ns) from cs fall after write command input, h or l is output. r/b display=l (busy) = write under execution after the timer circuit in the ic works and creat es the period of te/w, this time circuit completes automatically. and write to the memory cell is made in the per iod of te/w, and during this period, other command is not accepted. r/b display = h (ready) = command wait status even after te/w (max.5ms) from write of the memory cell, the following command is accepted. therefore, cs=h in the period of te/w, and when i nput is in sk, di, malfunction may occur, therefore, di=l in the area cs=h. (especially, in the ca se of shared input port, attention is required.) *do not input any command while status signal is output. command input in busy area is cancelled, but command input in ready ar ea is accepted. therefore, status ready output is cancelled, and malfunction and mistake write may be made. microcontroller vilm l input iole vole l output eeprom rpu microcontroller vihm h input iohe vohe h output eeprom rpd figure 44. do pull up resistance rpu ??? 5 0.4 2.1 10 -3 rpu 2.2 [k ] vole vilm ??? rpu example) when v cc =5v , vole=0.4v, iole=2.1ma, vilm=0.8v, from the equation , vcc vole iole with the value of rpu to satisfy the above equation, vole becomes 0.4v or below, and with vilm(=0.8v), the equation is also satisfied. rpd ??? 5 0.2 0.1 10 -3 rpd 48 [k ] vohe vihm ??? rpd example) when v cc =5v , vohe=vcc 0.2v, iohe=0.1ma, vihm=vcc 0.7v from the equation , vohe iohe with the value of rpd to satisfy the above equation, vohe becomes 2.4v or below, and with vi hm (=3.5v), the equation is also satisfied. figure 45. do pull down resistance (do status) (do status) : eeprom vol specifications : eeprom iol specifications : microcontroller vil specifications ? vole ? iole ? vilm : eeprom voh specifications : eeprom ioh specifications : microcontroller vih specifications ? vohe ? iohe ? vihm figure 46. r/b status output timing chart t sv cs high-z sk di do clock write instruction ready busy status downloaded from: http:///
datasheet datasheet 19/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 6) when to directly connect di and do this ic has independent input terminal di and output terminal do, and separate signals are handled on timing chart, meanwhile, by inserting a resistance r between these di and do terminals, it is possible to carry out control by 1 control line. data collision of microcontroller di/o output and do output and feedback of do output to di input. drive from the microcontroller di/o output to di input on i/o timing, and signal output from do output occur at the same time in the following points. (1) 1 clock cycle to take in a0 address data at read command dummy bit 0 is output to do terminal. when address data a0 = 1 input, through current route occurs. (2) timing of cs = h after write command. do terminal in ready / busy function output. when the next start bit input is recognized, high-z gets in. especially, at command input after write, when cs input is started with microcontroller di/o output l, ready output h is output from do te rminal, and through current route occurs. feedback input at timing of these (1) and (2) does not cause di sorder in basic operations, if resistance r is inserted. note) as for the case (2), attentio n must be paid to the following. when status ready is output, do and di are shared, di=h and the microcontroller di/o=high-z or the microcontroller di/o=h ,if sk clock is input, do output is input to di and is recognized as a start bit, and malfunction may occur. as a method to avoid malfunction, at status ready output, set sk=l, or start cs within 4 cl ocks after h of ready signal is output. microcontroller di/o port di eeprom do r figure 47. di, do control line common connection eeprom cs input eeprom sk input eeprom di input eeprom do output microcontroller di/o port a1 high-z collision of di input and do output h a0 0 d15 d14 d13 a1 a0 high-z microcontroller output microcontroller input figure 48. collision timing at read data output at di, do direct connection eeprom cs input eeprom sk input eeprom di input eeprom do output microcontroller di/o port write command microcontroller output busy busy ready ready ready collision of di input and do output hig h-z write command write command write command write command microcontroller input microcontroller output figure 49. collision timing at di, do direct connection cs sk di do ready high-z start bit because di=h, set sk=l at cs rise. figure 50. start bit input timing at di, do direct connection downloaded from: http:///
datasheet datasheet 20/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com selection of resistance value r the resistance r becomes through current limit resistance at data collision. when through current flows, noises of power source line and instantaneous stop of power source ma y occur. when allowable through current is defined as i, the following relation should be satisfied. determine allow able current amount in consi deration of impedance and so forth of power source line in set. and insert resistance r, and set the value r to satisfy eeprom input level vih/vil even under influence of voltage decline owing to leak current and so forth. insertion of r will not cause any influence upon basic operations. (1) address data a0 = 1 inpu t, dummy bit 0 output timing (when microcontroller di/o output is h, eepr om do outputs l, and h is input to di) ? make the through current to eeprom 10ma or below. ? see to it that the level vih of eeprom should satisfy the following. (2) do status ready output timing (when the microcontroller di/o is l, eeprom do output h, and l is input to di) ? set the eeprom input level vil so as to satisfy the following. microcontroller di/o port di eeprom do r h output iohm vohm vole l output figure 51. circuit at di, do direct connection (microcontroller di/o h output, eeprom l output) conditions vohm vihe vohm iohm r + vole at this moment, if vole=0v, vohm iohm r r ??? vohm iohm microcontroller di/o port di eeprom do r l output iohm volm vohe h output volm vile volm vohe C iolm r as this moment, vohe=vcc volm vcc C iolm r ??? vcc C volm iolm figure 52. circuit at di, do direct connection (microcontroller di/o l output, eeprom h output) example) when vcc=5v, vohm=5v, iohm=0.4ma, volm=5v, iolm=0.4ma, from the equation , from the equation , r r vohm iohm 5 0.4 10 -3 r 12.5 [k ] ??? r r vcc C volm iolm 5 C 0.4 2.1 10 -3 r 2.2 [k ] ??? therefore, from the equations and , r 12.5 [k ] : eeprom vih specifications : eeprom vol specifications : microcontroller voh specifications : microcontroller ioh specifications ? vihe ? vole ? vohm ? iohm : eeprom vil specifications : eeprom voh specifications : microcontroller vol specifications : microcontroller iol specifications ? vile ? vohe ? volm ? iolm conditions downloaded from: http:///
datasheet datasheet 21/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 7) notes on power on/off ? at power on/off, set cs l. when cs is h, this ic gets in input accept status (active) . if power is turned on in this status, noises and the likes may cause malfunction, mistake write or so. to prevent these, at power on, set cs l. (when cs is in l status, all inputs are cancelled.) and at power decline, owing to power line capaci ty and so forth, low power status may continue long. at this case too, owing to the same reason, malfunction, mistake write may occur, therefore, at power off too, set cs l. por citcuit this ic has a por (power on reset) circuit as a mistake write countermeasure. after po r operation, it gets in write disable status. the por circuit is valid only when power is on, and does not work when power is off. however, if cs is h at power on/off, it may become write enable status owing to noises and the likes. for secure operations, observe the follwing conditions. 1. set cs=l 2. turn on power so as to satisfy the recommended cond itions of tr, toff, vbot for por circuit operation. lvcc circuit lvcc (vcc-lockout) circuit prevents data rewrite oper ation at low power, and prevents wrong write. at lvcc voltage (typ.=1.2v) or below, it prevent data rewrite. 8) noise countermeasures v cc noise (bypass capacitor) when noise or surge gets in the power source line, malfunc tion may occur, therefore, for removing these, it is recommended to attach a by pass capacitor (0.1f) between ic v cc and gnd, at that moment, attach it as close to ic as possible.and, it is also recommended to attach a bypass capacitor between board v cc and gnd. sk noise when the rise time (tr) of sk is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit displacement. to avoid this, a sc hmitt trigger circuit is built in sk input. the hysteresis width of this circuit is set about 0.2v, if noises exist at sk input, set the noise am plitude 0.2vp-p or below. and it is recommended to set the rise time (tr) of sk 100ns or below. in the case when t he rise time is 100ns or higher, take sufficient noise countermeasures. make the clock rise, fall time as small as possible. t off t r vbot 0 v cc t r t off vbot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below figure 53. timing at power on/off figure 54. rise waveform diagram (bad example) cs pin is pulled up to vcc. in this case, cs becomes h (active st atus), and eeprom may have malfunction, mistake write owing to noise and the likes. even when cs in p ut is hi g h-z, the status becomes like this case, which p lease note. (good example) it is l at power on/off. set 10ms or higher to recharge at power off. when power is turned on without observing this condition, ic internal circuit may not be reset, which please note. recommended conditions of t r , t off , vbot cc v gnd v cc gnd v cc cs bad example good example downloaded from: http:///
datasheet datasheet 22/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com notes for use (1) described numeric values and data are design repres entative values, and the values are not guaranteed. (2) we believe that application circuit examples are recommendabl e, however, in actual use, confirm characteristics further sufficiently. in the case of use by changing the fixed number of external parts, make your decisi on with suffici ent margin in consideration of static characteristics and transition characteristics and fluct uations of external parts and our ic. (3) absolute maximum ratings if the absolute maximum ratings such as impressed voltage and operating temperature range and so forth are exceeded, ic may be destructed. do not impress voltage and temperatur e exceeding the absolute maximum ratings. in the case of fear exceeding the absolute maximum ratings, take physical sa fety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to ic. (4) gnd electric potential set the voltage of gnd terminal lowest at any operating condition. make sure that each terminal voltage is not lower than that of gnd terminal in consid eration of transition status. (5) heat design in consideration of allowable loss in actual use cond ition, carry out heat design with sufficient margin. (6) terminal to terminal shortcircuit and wrong packaging when to package ic onto a board, pay suff icient attention to ic direction and displacement. wrong packaging may destruct ic. and in the case of shortcircuit between ic terminals and terminals and power source, terminal and gnd owing to foreign matter, ic may be destructed. (7) use in a strong electromagnetic field may cause malfunction, therefore, ev aluate design sufficiently . downloaded from: http:///
datasheet datasheet 23/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com ordering information product code description b r 9 3 a x x x x - w m x x bus type 93 microwire operating temperature -40 to +105 capacity 46=1k 76=8k 56=2k 86=16k 66=4k package type f, rf : sop8 fj, rfj : sop-j8 rfvt : tssop-b8 rfvm : msop8 w : double cell m : for automotive application package specifications e2 embossed tape and reel (sop8, sop-j8, tssop-b8) tr embossed tape nad reel (msop8) lineup capacity package capacity package type quantity type quantity 1k sop8 reel of 2500 8k sop8 reel of 2500 sop-j8 sop-j8 tssop-b8 reel of 3000 tssop-b8 reel of 3000 msop8 msop8 2k sop8 reel of 2500 16k sop8 reel of 2500 sop-j8 sop-j8 tssop-b8 reel of 3000 tssop-b8 reel of 3000 msop8 msop8 4k sop8 reel of 2500 sop-j8 tssop-b8 reel of 3000 msop8 downloaded from: http:///
datasheet datasheet 24/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop8 0.9 0.15 0.3min 4 + 6 4 0.17 +0.1 - 0.05 0.595 6 4 3 8 2 5 1 7 5.0 0.2 6.2 0.3 4.4 0.2 (max 5.35 include burr) 1.27 0.11 0.42 0.1 1.5 0.1 s 0.1 s downloaded from: http:///
datasheet datasheet 25/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop-j8 4 + 6 4 0.2 0.1 0.45min 234 5 6 7 8 1 4.9 0.2 0.545 3.9 0.2 6.0 0.3 (max 5.25 include burr) 0.42 0.1 1.27 0.175 1.375 0.1 0.1 s s downloaded from: http:///
datasheet datasheet 26/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information C continued (unit : mm) tssop-b8 0.08 s 0.08 m 4 4 234 8765 1 1.0 0.05 1pin mark 0.525 0.245 +0.05C0.04 0.65 0.145 +0.05 C0.03 0.1 0.05 1.2max 3.0 0.1 4.4 0.1 6.4 0.2 0.5 0.15 1.0 0.2 (max 3.35 include burr) s direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin downloaded from: http:///
datasheet datasheet 27/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information C continued (unit : mm) msop8 0.08 s s 4.0 0.2 8 3 2.8 0.1 1 6 2.9 0.1 0.475 4 5 7 (max 3.25 include burr) 2 1pin mark 0.9max 0.75 0.05 0.65 0.08 0.05 0.22 +0.05C0.04 0.6 0.2 0.29 0.15 0.145 +0.05C0.03 4 + 6 4 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet datasheet 28/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com marking diagrams marking information capacity product name marking package type 1k a46 sop8 ra46 a46 sop-j8 ra46 ra46 tssop-b8 ra46 msop8 2k a56 sop8 ra56 a56 sop-j8 ra56 ra56 tssop-b8 ra56 msop8 4k a66 sop8 ra66 a66 sop-j8 ra66 ra66 tssop-b8 ra66 msop8 8k a76 sop8 ra76 a76 sop-j8 ra76 ra76 tssop-b8 ra76 msop8 16k a86 sop8 ra86 a86 sop-j8 ra86 ra86 tssop-b8 ra86 msop8 msop8(top view) part number marking lot numbe r 1pin mark sop8(top view) part number marking lot numbe r 1pin mark sop-j8(top view) part number marking lot number 1pin mark tssop-b8(top view) part number marking lot numbe r 1pin mark downloaded from: http:///
datasheet datasheet 29/29 br93axx-wm (1k 2k 4k 8k 16k) tsz02201-0r1r0g100150-1-2 6.nov.2013 rev.003 ?2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com revision history date revision changes 31.aug.2012 001 new release 4.mar.2013 002 p.2 add a endurance limit at 60 6.nov.2013 003 p.1 added aec-q100 qualified p.2 changed unit of pd p.23 update product code description downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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